Tianjin Hwatsing Technology Co.,Ltd
Tianjin Hwatsing Technology Company Limited, established by Tianjin government and Tsinghua University to implement the national strategy of "integration of the Beijing-Tianjin-Hebei region" in 2013，is a high-tech enterprise to promote the industrialization of CMP technology and equipment in China.
Hwatsing is mainly engaged in the research, production, sales and service of the CMP equipment/process/ related consumables. The core team members are from State Key Laboratory of Tribology of Tsinghua University and experts in the industry. The products can be widely used in the field of ULSI manufacturing, packaging, MEMS, wafer planarization, substrate fabrication, etc.
Hwatsing is devoted to provide advanced integrated solutions of CMP equipment and process for enterprises, universities and research institutes with its international business philosophy, excellent team and advanced experimental conditions. With the company tenet of “Science & technology for Community” and continuous customer-oriented innovations, Hwatsing wins the trust of domestic and foreign customers by high product quality and excellent service.
Universal-300 Plus is an upgraded equipment based on Universal-300 mature technology. It can be greatly meet different customer process requirements with advanced competitiveness.
Integrated multiple endpoint systems
Universal-300 Dual is a new 12 inch CMP equipment model to meet market needs. It adopts mature technology of Universal-300 Plus, with 4 polish platens, 2 cleaner sets, and integrates multiple Endpoint detection technology. It meets customer demands on equipment with high output, highly reliable, flexible process combination capabilities, so it is highly competitive on CMP equipment market.
Universal-300 is domestic first 12-inch CMP production tool in foundry. The tool is high technology and high reliability. It can be used in integration circuit making, wafer producing, CMP
abrasive material development and etc.
Universal-200 Plus is a new 8 inch CMP equipment model to meet market needs. It adopts mature technology of Universal-300 Plus, with 4 polish platens, 2 cleaner sets ,and integrates multiple Endpoint detection technology. It meets customer demands on equipment with high output, highly reliable, flexible process combination capabilities, so it is highly competitive on CMP equipment market.
Chemical mechanical polishing foundry services
Hwatsing has developed many series of high precision CMP equipment. We have a professional technical team, standard IC manufacture clean room and precise instruments for measurement and analysis (FILMETRIX F50, ResMap, Olympus microscope, four probe tester, etc.) We share themeasurement analysis platform with National Key Laboratory of Tribology, Tsinghua University. We could accurately measure the film thickness,roughness, Dishing, Erosion, etc. for metal/nonmetal. We provide CMP foundry service and CMP technology development service for 2-12 inch wafer .
Foundry service includes:
Si/Oxide/W/Cu and Patter wafer CMP foundry service;
MEMS foundry service;
TSV CMP foundry service;
Wafer reclaim CMP foundry services;
Foundry service for multiple materials such as sapphire, gallium arsenide.
CMP technology development service includes:
Validation of CMP related consumables and technological development;
CMP technology development for new process and new materials;
Customized CMP process development.
HWATSING TECHNOLOGY CO.,LTD
Add.：No.8 building,No.9 Ju Xing Road,Hai He Sci-tech Park,Jinnan District,Tianjin,China Tel.： 022-59781212
Email: email@example.com For more information, view HWATSING APP.